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Showing posts with the label Anti-Static Packaging Materials Market Share

The Global Anti-Static Packaging Materials Market Growing Demand from Electronics Sector Drives Growth

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  Anti-static packaging materials are used to protect electronic components and integrated circuits from electrostatic discharge (ESD), which can damage or destroy sensitive electronic components. These materials find widespread application in the electronics sector for packaging various components such as processors, static-sensitive integrated circuits, and printed circuit boards. The global anti-static packaging materials market is estimated to be valued at US$ 606.6 Mn in 2023 and is expected to exhibit a CAGR of 5.6% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights. Market key trends One of the key trends driving growth in the anti-static packaging materialsmarket is the rising demand for consumer electronics. Consumer electronics such as smartphones, laptops, tablets, televisions, and others contain highly sensitive electronic components and integrated circuits. Improper handling or storage of such devices without ...