The Global Anti-Static Packaging Materials Market Growing Demand from Electronics Sector Drives Growth

 


Anti-static packaging materials are used to protect electronic components and integrated circuits from electrostatic discharge (ESD), which can damage or destroy sensitive electronic components. These materials find widespread application in the electronics sector for packaging various components such as processors, static-sensitive integrated circuits, and printed circuit boards. The global anti-static packaging materials market is estimated to be valued at US$ 606.6 Mn in 2023 and is expected to exhibit a CAGR of 5.6% over the forecast period 2023 to 2030, as highlighted in a new report published by Coherent Market Insights.

Market key trends

One of the key trends driving growth in the anti-static packaging materialsmarket is the rising demand for consumer electronics. Consumer electronics such as smartphones, laptops, tablets, televisions, and others contain highly sensitive electronic components and integrated circuits. Improper handling or storage of such devices without adequate protective packaging can damage the electronics. This has increased the need for effective anti-static packaging solutions. According to the World Bank, global sales of smartphones increased from 1.57 billion units in 2017 to 1.62 billion units in 2020. Rising incomes and increased digitization are factors fueling the consumer electronics market. This growing demand acts as a key growth driver for anti-static packaging materials.
Segment Analysis

The global anti-static packaging materials market is dominated by polyethylene segment. Polyethylene provides effective and cost-efficient protection against static electricity, making it the preferred material for packaging of electronic components. It is widely used forbags, tubing, shrink films and other packaging formats that require anti-static properties. Within polyethylene, low density polyethylene (LDPE) accounts for major share as it can be easily extruded into thin films providing good barrier characteristics.

Key Takeaways

The global anti-static packaging materials market is expected to witness high growth over the forecast period of 2023 to 2030. Regional analysis

Regional analysis shows that Asia Pacific region currently dominates the global market and is expected to maintain its lead position during the forecast period. The widespread electronics manufacturing industry in countries like China, Taiwan, South Korea, Singapore drives the demand for anti-static packaging in the region. North America is projected to be the fastest growing regional market, supported by growing semiconductor and automotive electronics sector in the US and Canada.

Key players

Key players operating in the anti-static packaging materials market are Daklapack Group, Sharp Packaging Systems, Polyplus Packaging Ltd., Protective Packaging Corporation Inc., Sekisui Chemical GmbH, Esdwork CO, LTD., Automated Packaging Systems, Inc., Cir-Q-Tech Tako Technologies, MARUAI Inc., and LPS Industries.

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